Fr4 PCB Proofing SMD/DIP Electronic Heater Fr4 PCBA

Fr4 PCB Proofing SMD/DIP Electronic Heater Fr4 PCBA

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Name: (4S,5S)-(+)-4,5-Bis(diphenylphosphinomethyl)-2,2-dimethyl-1,3-dioxolane (DIOP)

CAS No.: 37002-48-5

EINECS: 253-307-9

MF: C31H32O2P2

MW: 498.53

MP: 86-89℃

BP: 590.3±25.0℃

FP: N/A

Density: N/A

Purity: 97% Min.

Appearance: White powder

Application: DIOP is an organophosphorus compound that is used as a chiral ligand in asymmetric catalysis.

Storage Condition: Store in a cool, dry place. Keep container closed when not in use.

Synonyms:

(+)-2,3-O-Isopropylidene-2,3-dihydroxy-1,4-bis(diphenylphosphino)-butane;

(+)-1,4-Bis(diphenylphosphino)-1,4-dideoxy-2,3-O-isopropylidene-D-threitol;

(4S,5S)-(+)-4,5-Bis(diphenylphosphinomethyl)-2,2- dimethyl-1,3-dioxolane.

 

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